Cooling Electronic Devices In A new Faster And Cheaper Way

Researchers of North Carolina State University have reached the new technique that will cool the electronic devices especially those who generate heat, as power devices and lasers. The new technique depend on using a heat spreader from copper-graphene, the heat spreader is attached to the device using attaching material made from indium-graphene. The heat spreader and the attaching material have higher thermal conductivity, which permit the device to cool with more efficiency than the used ways nowadays.

A North Carolina State University researcher has developed a more efficient, less expensive way of cooling electronic devices — particularly devices that generate a lot of heat, such as lasers and power devices. The technique uses a “heat spreader” made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film “Both the copper-graphene and indium-graphene have higher thermal conductivity, allowing the device to cool efficiently,” says Dr. Jag Kasichainula, an associate professor of materials science and engineering at NC State and author of a paper on the research. Thermal conductivity is the rate at which a material conducts heat.

In fact, Kasichainula found that the copper-graphene film’s thermal conductivity allows it to cool approximately 25 percent faster than pure copper, which is what most devices currently use.

Dissipating heat from electronic devices is important, because the devices become unreliable when they become too hot.

The paper also lays out the manufacturing process for creating the copper-graphene composite, using an electrochemical deposition process. “The copper-graphene composite is also low-cost and easy to produce,” Kasichainula says. “Copper is expensive, so replacing some of the copper with graphene actually lowers the overall cost.”

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